
AdvantEdge 300 TF is
designed for high volume production of printed circuit boards. It offers excellent line width control,
elimination of slivering, consistent etch rates and superior undercut
protection. The relatively low operating
pH of AdvantEdge 300 TF increases the ability of typical resists to withstand
the tendency to soften or lift. As indicated by the initials “TF”, all this is
achieved without the addition of thiourea.
AdvantEdge 300 TF is
designed for use in conveyorized spray etching
equipment having thermostatic temperature controls and proper ventilation. The venting system must be capable of
creating a slight negative pressure in order to confine ammonia fumes to the
etch chamber.
Property/(Unit)
|
Typical
Specifications
|
||
Ammonium Chloride - g/l |
233 |
- |
247 |
Ammonium Chloride - N |
4.36 |
- |
4.62 |
Total Alkalinity - g/l |
300 |
- |
330 |
Total Alkalinity - N |
4.98 |
- |
5.47 |
Copper – ppm |
|
< |
70 |
pH |
9.5 |
- |
9.9 |
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2003 Micronutrients |
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